Requirements: Experience in transfer technology, process technology, and device physics. Silicon Germanium experience preferred. Lead or coordinate projects to reduce defects, improve process control, minimize rework, study process windows for new devices, qualify tools, evaluate consumables, and develop cost-effective processes. Analyze E-test and yield data, resolve wafer issues, and write procedures, specifications, and test programs. Use advanced analytical tools to solve wafer fabrication problems as part of a team. Ideal candidates come from other Fab/Semiconductor companies . New PhD graduates must have an Electrical Engineering degree; candidates with 3+ years of experience can have any engineering degree. Intel-only experience lacks versatility; candidates will be considered if Intel is part of their broader experience. Position details: Reports to the Director of Integration Integration team consists of about 15 members Job Description Responsible for developing, improving, and sustaining all manufacturing process flows; development of new process modules; leading and coordinating complex projects. Lead and collaborate on Technology transfers and development of new technology. Coordinate the introduction, qualification, and ramp to volume of new process flows for foundry customers. Interacts and collaborates with Process Engineering, Equipment Engineering, Operations, and R&D groups on inter-departmental and cross-functional projects. Interact with customers on both engineering and executive levels to work technical issues and present project summaries and updates. Direct failure analysis efforts, analyze E-test and yield data and provide feedback to engineers and managers to continuously improve the manufacturing process. This Job Is For You If • Lead or coordinate projects to minimize defects, improve process control, reduce rework, study process window for new devices, qualify new tools, evaluate new consumables and develop new processes for better performance and lower cost • Analyze E-test and Yield data, disposition problem wafers and lots. Write E-test procedures, specifications, documentation and test programs. • Utilize advanced analytical tools and techniques and participate in teams to solve wafer fabrication problems • Write process capability reports for process engineering and customer review • Lead or participate in intra- or inter-departmental efforts to manage process crises: containing damage, investigating and identifying root causes and implementing corrective and preventive actions • Participate in inter-departmental projects toward technology development and yield enhancement • Help drive continuous improvement projects to drive improved D0's, reduce scrap, and improve device performance Job Requirements • MS or PhD in Electrical or Chemical Engineering, Physics or Materials Science • Ability to communicate and present technical concepts and analysis in an effective manner • Knowledge and experience in one or more of the following areas: Process Integration, Device Physics, ThinFilms, Etch, CMP, Photolithography, Diffusion, CMP, Implant, E-Test • Experience with SPC and DOE is required, 8D, FMEA, and structured problem solving is preferred.