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Smts/Dmts, Advanced Packaging Architect

Smts/Dmts, Advanced Packaging Architect
Company:

Micron


Place:

Idaho


Job Function:

Distribution

Details of the offer

Our vision is to transform how the world uses information to enrich life forall.Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.AsanSenior Member of Technical Staff orDistinguished Member of Technical StaffinAdvanced PackagingTechnology Development, you will?be a technicalleader inMicron's?Advanced Packaging?strategy and?drive?technicalinnovationand engagementwith both internal and external customers to enable a best-in-classproduct roadmapenabled by innovative and industry leading memory and heterogenous integrated packaging solutions.You will?have the opportunity to collaborate?with?the industry leading technologists at?partnersengaged in advancing High Performance Computing and AI solutions that require memory and logic architectures and packaging technology that offers differentiated performance.You?will collaborate with?Micron's world-wide?talent thatincludefront end silicondevelopment,product and systemengineering,?high volumemanufacturing operations.Inthis role, you will?directly interact with?senior executives on thetechnology which enablesproduct plans andhow to enable it.?Together, we willbe responsible forthe?definition, development, and delivery?ofstate-of-the-artproducts that?will?advance?computeand shape?the?future?of?this planet?and beyond.You must be comfortable and adept at dealing with uncertainty and find ways toidentify andestablish value, understand challenges and work across domain expertise, and across functions toconvert challenges from"cannotdo"to"cando",and conversations from "can do, but" to "and, can do"through analysis, developing a strategy, educating,garnering support and driving execution.Responsibilities will include, but are not limited to:Develop andmaintainstrongrelationships and understanding of what technical solutions would enable our customers from an interconnect,packagingandcost-effectiveproduct solution.Drivedevelopment of technicalsolutions with SoC architects, silicon design, and product teams to recommend theoptimumpackagesolutions to meet electrical, mechanical, thermal, and other system level requirements. Introducing novel solutions atappropriate pointsto enable these solutions.Enablepackage design and assembly of advanced 2.5D/3D packages,throughselectionofmaterials, body sizes,tooling requirements, process capability evaluation and improvement, and package constructions to achieve acceptable Design for Manufacturing and High-Volume Manufacturing cost and efficiencyrequirements.Interface closely with Micron's internal manufacturing and?external?partners to productize advanced packaging solutions from concept to prototyping, testing and sample deliveryto mass production phases.Support and collaborate with customers to ensure that Micron's products can meet their quality, reliability, system, and operational needs.Successful candidates for this position will have:An established network with peers in the industry and relationships with key stakeholders?Proven ability to drivepackaging roadmaps, engage vendors and suppliersandsupport business unit leaders in customer engagements.Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical stakeholders.Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO,SoIC,CoWoS, WoW,InFO, and otherchiplet/SiParchitectures.?Experience with wafer bumping, wafer bonding, package assembly, substrate technology, BOM selection, testing and product development lifecycle.Strong publication record, patents, or contributions to industry standards are highly desirable.Demonstrated leadership experience in guiding cross-functional teams and driving technical excellence.Required Experience:Bachelor/Master of Science in materials, mechanical, chemical, or electrical engineering. MS or PhDpreferred.10+ years of relevant experienceAs a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays.For additional information regarding the Benefit programs available, please see the Benefits Guide posted onmicron.com/careers/benefits.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.To learn about yourright to work click here.To learn more about Micron, please visitmicron.com/careersFor US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization ****** 1-800-336-8918 (select option #3)Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.


Job Function:

Requirements

Smts/Dmts, Advanced Packaging Architect
Company:

Micron


Place:

Idaho


Job Function:

Distribution

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