Job Title: Director of System in Package Architecture
Office Location: San Jose, CA
Work Model: Onsite
At SK hynix America, we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies. Our cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape.
We're looking for innovative minds to join our mission of shaping the future of technology. At SK hynix America, you'll be part of a team that's pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. We're not just adapting to technological change – we're driving it, with significant investments in artificial intelligence, machine learning, and eco-friendly solutions and operational practices. As we continue to expand our market presence and push the boundaries of what's possible in semiconductor technology, we invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing.
Responsibilities:Lead advanced packaging system architecture development to improve System in Package performance including High Bandwidth Memory (HBM)Drive mechanical and electrical test vehicle design and development when necessaryResearch and develop novel technologies for System in Package performance improvement along with SOC and HBM heterogeneous integrationLead collaboration with internal and external stakeholders to ensure seamless advanced packaging technology developmentMinimum Qualifications:BS in Electrical Engineering or equivalent industry experience7+ years of experiences in advanced packaging architecture definition and developmentEffective communication skillsExperience working effectively with cross-functional teamsPreferred Qualifications:Master Degree or PhD in Electrical Engineering or equivalent industry experience10+ years of experiences in advanced packaging architecture definition and development (2.5D/3D)Working knowledge in 2.5D/3D packaging technologies and large body substrate technologiesWorking knowledge in Signal integrity and Power integrityExperience in High Bandwidth Memory (HBM) architecture is a plusTotal Rewards:Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. The U.S. pay range for this position is base $220,000 - $254,000. Pay within this range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process.
Our benefits include:Top Tier health insurance at no employee costPaid day offs: PTO + Company Holidays + Happy FridaysPaid Parental Leave Program401k MatchingEducational reimbursement up to $10,000 per yearDonation Matching and volunteering opportunitiesCorporate discount programsFree Breakfast/Lunch/Dinner provided to employeesEqual Employment Opportunity:SKHYA is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information or any other status protected under federal, state, or local applicable laws.
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